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EVERLIGHT ELECTRONICS CO.,LTD.
Technical Data Sheet High Power LED - 1W
EHP-A07/SUR01-P01
Features
feature of the device: small package with high efficiency View angle: 120. high luminous flux output: more than 28lm@350mA. ESD protection. soldering methods: SMT. grouping parameter: total luminous flux, dominant wavelength. optical efficiency: 37 lm/W. Thermal resistance (junction to lead): 17 K/W. RoHS: The product itself will remain within RoHS compliant version
Applications
TFT LCD display backlight Decorative and entertainment illumination Signal and symbol luminaries for orientation signals (e.g. steps, exit ways, etc.) Exterior and interior automotive illumination
Materials
Items Housing Encapsulating Resin Electrodes Die attach Chip Description Heat resistant polymer Clear silicone resin Ag plating copper alloy Silver paste AlGaInP
Everlight Electronics Co., Ltd. Device No. : DSE-7N1-002
http://www.everlight.com Prepared date: Sep 10, 2006
Rev. 2.0
Page: 1 of 10
Prepared by: Peggy Chen
EVERLIGHT ELECTRONICS CO.,LTD. EHP-A07/SUR01-P01
Dimensions Cathode mark
Notes: 1. Dimensions are in millimeters 2. Tolerances unless dimensions 0.25mm Everlight Electronics Co., Ltd. Device No. : DSE-7N1-002 http://www.everlight.com Prepared date: Sep 10, 2006 Rev. 2.0 Page: 2 of 10
Prepared by: Peggy Chen
EVERLIGHT ELECTRONICS CO.,LTD. EHP-A07/SUR01-P01
Maximum Ratings (T Ambient=25C)
Parameter Operating Temperature Storage Temperature Junction temperature Forward Current Power Dissipation Junction to heat-sink thermal resistance Symbol Topr Tstg Tj IF Pd Rth Rating -40 ~ +100 -40 ~ +100 125 500 1.5 17 Unit C C C mA W K/W
Electro-Optical Characteristics (T Ambient=25C)
Parameter Bin J1 Luminous Flux(1) J2 J3 Viewing Angle(2) ---U2 Forward Voltage(3) U3 U4 R3 R4 Wavelength(4) R5 R6 R7 d VF 21/2 v Symbol Min 23 27 33 ---2.05 2.35 2.65 610 615 620 625 630 Typ. ---------120 ------------------------Max 27 33 39 ---2.35 2.65 2.95 615 620 625 630 635 nm V IF=350mA deg lm Unit Condition
Note. 1. Luminous flux measurement tolerance : 10% 2. 21/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value. 3. Forward Voltage measurement tolerance : 0.1V 4. Wavelength measurement tolerance : 1nm
Everlight Electronics Co., Ltd. Device No. : DSE-7N1-002
http://www.everlight.com Prepared date: Sep 10, 2006
Rev. 2.0
Page: 3 of 10
Prepared by: Peggy Chen
EVERLIGHT ELECTRONICS CO.,LTD. EHP-A07/SUR01-P01
Typical Electro-Optical Characteristics Curves
Relative Spectral Distribution, IF=350mA, T Ambient=25C
2.4 1.0
Forward Voltage vs Forward Current, T Ambient=25C
Relative Luminous Intensity (%)
2.3 0.8
Forward Voltage (Volt)
600 700 800
2.2
0.6
2.1
0.4
2.0
0.2
1.9 0.0 500 1.8 0 100 200 300 400 500
Wavelength (nm)
Forward Current (mA)
Relative Luminous Intensity vs Forward Current, T Ambient=25C
1.4 1.2
Forward Current Derating Curve, Derating based on TJMAX=125C
400 350 300 250 200 150 100
Relative Luminous Intensity
1.0 0.8 0.6 0.4 0.2 0.0
Forward Current (mA)
0
50
100
150
200
250
300
350
400
450
500
550
0
20
40
60
80
100
Forward Current (mA)
Ambient Temperature (C)
Everlight Electronics Co., Ltd. Device No. : DSE-7N1-002
http://www.everlight.com Prepared date: Sep 10, 2006
Rev. 2.0
Page: 4 of 10
Prepared by: Peggy Chen
EVERLIGHT ELECTRONICS CO.,LTD. EHP-A07/SUR01-P01
Typical Representative Spatial Radiation Pattern
0 10
1.0 0.9
20 30 40 50 60 70 80 90
Relative Intensity
0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0
Angle (Degree)
Everlight Electronics Co., Ltd. Device No. : DSE-7N1-002
http://www.everlight.com Prepared date: Sep 10, 2006
Rev. 2.0
Page: 5 of 10
Prepared by: Peggy Chen
EVERLIGHT ELECTRONICS CO.,LTD. EHP-A07/SUR01-P01
Label explanation
CPN: Customer's Production Number P/N : Production Number QTY: Packing Quantity CAT: Ranks HUE: Peak Wavelength REF: Reference LOT No: Lot Number MADE IN TAIWAN: Production Place
Reel Dimensions
Note: 1. Dimensions are in millimeters 2. The tolerances unless mentioned is 0.1mm
Everlight Electronics Co., Ltd. Device No. : DSE-7N1-002
http://www.everlight.com Prepared date: Sep 10, 2006
Rev. 2.0
Page: 6 of 10
Prepared by: Peggy Chen
EVERLIGHT ELECTRONICS CO.,LTD. EHP-A07/SUR01-P01
Carrier Tape Dimensions: Loaded quantity 800 PCS per reel.
Note: 1. Dimensions are in millimeters 2. The tolerances unless mentioned is 0.1mm
Moisture Resistant Packaging
Label
Aluminum moistue-proof bag
Desiccant
Label
Everlight Electronics Co., Ltd. Device No. : DSE-7N1-002
http://www.everlight.com Prepared date: Sep 10, 2006
Rev. 2.0
Page: 7 of 10
Prepared by: Peggy Chen
EVERLIGHT ELECTRONICS CO.,LTD. EHP-A07/SUR01-P01
Reliability Test Items and Results
Stress Test Solderability Reflow Thermal Shock Stress Condition Tsol=230, 5sec Tsol=260, 10sec, 6min H110 20min. ' 10sec. 'L 40 20min. H100 30min. ' 5min. 'L 40 30min. Ta=85 , RH=85% Ta=110 Ta=-40 Ta=25, IF=1000mA 30mS on/ 2500mS off Ta=55, IF=350mA Ta=85, IF=225mA Ta=100, IF=150mA Ta=-40, IF=350mA H85 15min. ' 5min. 'L 40 15min. IF=225mA,2min on/off 2000V, Interval:0.5sec 200V, Interval:0.5sec Stress Duration 1 times 3 times 500 Cycles
Temperature Cycle
1000 Cycles
High Temperature/Humidity Reverse Bias High Temperature Storage Low Temperature Storage Intermittent operational Life High Temperature Operation Life #1 High Temperature Operation Life #2 High Temperature Operation Life #3 Low Temperature Operation Life
1000hours 1000hours 1000hours 1000hours 1000hours 1000hours 1000hours 1000hours
Power Temperature Cycle
1000cycles
ESD Human Body Model ESD Machine Model
3 times 3 times
*lm: BRIGHTNESS ATTENUATE DIFFERENCE(1000hrs)50% *VF: FORWARD VOLTAGE DIFFERENCE20%
Everlight Electronics Co., Ltd. Device No. : DSE-7N1-002
http://www.everlight.com Prepared date: Sep 10, 2006
Rev. 2.0
Page: 8 of 10
Prepared by: Peggy Chen
EVERLIGHT ELECTRONICS CO.,LTD. EHP-A07/SUR01-P01
Precautions For Use
1. Over-current-proof Though EHP-A07 has conducted ESD protection mechanism, customer must not use the device in reverse and should apply resistors for extra protection. Otherwise slight voltage shift may cause enormous current change and burn out failure would happen. 2. Storage i. ii. iii. iv. v. vi. vii. Do not open moisture proof bag before the products are ready to use. Before opening the package, the LEDs should be kept at 30 or less and 90%RH or less. The LEDs should be used within a year. After opening the package, the LEDs should be kept at 30 or less and 70%RH or less. The LEDs should be used within 168 hours (7 days) after opening the package. If the moisture absorbent material (silicone gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Pre-curing treatment : 605 for 24 hours.
3. Thermal Management i. ii. Because EHP-A07 LED is a high power dissipation device, special and sufficient consideration in thermal management design must be made to optimize the thermal performance. Heat sink design is implemented in the device for an additional thermal connection. Since the device is capable of SMT process, tin must be spread both heat sink and solder pads areas to dissipate the heat. iii. A high thermal conductivity substrate, such as Aluminum or Copper plate etc, must be applied for external thermal management. It is strongly recommended that the outer heat sink or PCB dimension per LED can not be less than 25 x 25 x 1 (L x W x H) mm. The materials for outer heat sink can be FR4 on Aluminum, MCPCB, or FPC on Aluminum. iv. v. Sspecial thermal designs are also recommended to take in outer heat sink design, such as FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal conductive adhesive, etc. Sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving and LED lifetime will decrease critically.
Everlight Electronics Co., Ltd. Device No. : DSE-7N1-002
http://www.everlight.com Prepared date: Sep 10, 2006
Rev. 2.0
Page: 9 of 10
Prepared by: Peggy Chen
EVERLIGHT ELECTRONICS CO.,LTD. EHP-A07/SUR01-P01
4. Soldering Condition i. Lead reflow soldering temperature profile
ii. iii. iv.
Reflow soldering should not be done more than two times. While soldering, do not put stress on the LEDs during heating. After soldering, do not warp the circuit board
5. Soldering Iron i. ii. iii. For prototype builds or small series production runs it is possible to place and solder the LED by hand. Dispensing thermal conductive glue or grease on the substrates and follow its curing spec. Press LED housing to closely connect LED and substrate. It is recommended to hand solder the leads with a solder tip temperature of 280C for less than 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. iv. Be careful because the damage of the product is often started at the time of the hand solder.
6. Handling Indications During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound.
Everlight Electronics Co., Ltd. Device No. : DSE-7N1-002
http://www.everlight.com Prepared date: Sep 10, 2006
Rev. 2.0
Page: 10 of 10
Prepared by: Peggy Chen

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